Failure Rates

2016 Product Reliability

The manufacture of Holy Stone ceramic capacitors is carried out in its modern high tech facility in Taiwan. This facility uses modern, state-of the-art equipment, with each process stage and materials carefully controlled. Statistical Process Control (SPC) is used at all process critical stages, to reduce manufacturing and product variations.

Every manufacturing lot is subject to Destructive Physical Analysis (DPA) and Scanning Acoustic Microscopy (SAM). Sample testing (AQL) is also carried out for Solderability, Resistance to Solder Heat, Humidity, Temperature Cycling, Flexture of Substrate and Vibration.

100% electrical testing is carried out for Capacitance, Dissipation Factor, Voltage proof and Insulation Resistance. In addition to this electrical testing HolyStone conducts an ongoing program of Endurance testing to provide customers with reliability data applicable to actual applications.
Samples from a cross section of product types are place onto High Temperature Endurance Test, enabling reliability or F.I.T. (Failures In Time) data to be calculated.

Notes:

  1.  1 F.I.T. = 1 component failure in 109 component hours
  2.  M.T.B.F. (Hours) = 109/FITS

High Temperature Test Conditions

Test Voltage = 1.2 to 2 times rated voltage (depending on component rated voltage) Temperature = +125°C
Duration = 1000 hours

The results of this endurance testing are shown below in the General Failure Rates. In addition this has been broken down to show the individual failure rates by dielectric for C0G/NP0 and X7R.

Holy Stone General Failure Rate

Holy Stone General Failure Rates

X7R Failure Rate

X7R FaIlure Rate

COG/NPO Failure Rate

COG/NPO Failure Rate
X5R Failure Rate
X5R Failure Rate
Comments

The failure rate (or F.I.T. rate) of a component, in any specific application, will be largely dependant on the operating temperature and percentage of the maximum working voltage it is subjected to. Designers should take into account their expected ‘system’ failure rate when choosing a suitable component. This may require a higher voltage device, to reduce the expected F.I.T. rate, although the operating voltage is within the maximum working voltage of the device.